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About this event
All are welcome to join us for Angélique Raley from Tokyo Electron (TEL) America speaking about "How Wafer Fab Equipment Enables High-Performance Computing and AI." Learn how advanced wafer fabrication equipment powers high-performance computing and AI by enabling precise, nanoscale chip manufacturing. Angélique Raley is a Senior Director of Technology for Semiconductor Integration and 3D Integration (3DI) at Tokyo Electron (TEL) America in Albany NY.
She leads multidisciplinary R&D programs focused on advanced semiconductor manufacturing and packaging technologies that enable next-generation AI and high-performance computing systems. Since joining TEL in 2010, she has played a key role in driving technology innovation and industry collaboration. Angelique earned an M.S. in Materials Science and Engineering from Polytech Grenoble, France, and has authored numerous technical publications, delivered invited presentations worldwide, and been awarded 60 U.S. patents.
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Doors open at 5:15 p.m. Registration preferred, not required.
Description from University at Albany.
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